MATERIAL:

      HOUSING:  PA66+30%GF MG0033

      CONTACT: COPPER ALLOY.

FINISH:

      CONTACT: MATING AREA-GOLD PLATING 1U",TIN-LEAD 

      ON SOLDER AREA 

      100m" OVER NICKEL PLATING.

 GOLD THICKNESS MEASUREMENT POINT

SPECIFICATIONS:

     ELECTRICAL:

       VOLTAGE RATING: 250 Vac RMS

       CURRENT RATING: 1 AMP

       INSULATION RESISTANCE: 1000 MW(min)

       CONTACT RESISTANCE: 30 mW (MAX)

     MECHANICAL:

       CONTACT RETENTION: 500 GRAMS (min) / CONTACT

       WITHDRAWAL FORCE: 15 GRAMS (min) / CONTACT PAIR

       INSETION FORCE: 230 GRAMS (MAX) / CONTACT PAIR  

 CRITICAL DIMENSION   SHOULD BE CONTROL BY QIP.

 PRODUCT NET WEIGHT: 6.68.g / pcs

SLIM PCI , 1.27mm , 120P    pdf  下載